Bostik Wood H550 Eco Plus

Benefits

• Very high initial adhesion
• Suitable for all wood types and all parquet styles
• Free of plasticizers
• Fast curing and locking of parquet pieces
• Exceptionally low emission values
• Odorless during application
• Sound-dampening effect
• Consumption: 700 to 1150 g/m²

Application

Elastic one-component adhesive based on Axios™ Trilinking™ technology for bonding all types of parquet on porous and sealed substrates (prepared according to DIN 18356):

• Engineered (2- and 3-layer parquet), all sizes (finished and unfinished)
• Solid parquet up to 200 mm wide and 23 mm thick
• Mosaic parquet
• End grain wood
• OSB boards (sanded), chipboard, and plywood
• Ideal for exotic wood species
• Less suitable for small-format parquet pieces

Bostik Eco Plus meets the shear strength requirements for elastic parquet adhesives according to DIN EN 14293 and ISO 17178. Suitable for all substrates such as concrete, wood, metal, old tiled floors, cement-bound screeds, and anhydrite screeds.

Processing

Allow the packaging content to reach room temperature before use. After opening, remove the protective foil and any skin formed, do not mix back into the product. Apply Parfix Eco Plus evenly to the substrate using a notched trowel. Immediately lay the parquet pieces into the adhesive bed and tap thoroughly to ensure 100% adhesive transfer to the back of the parquet pieces. Provide an expansion joint of about 10 mm between walls and parquet. Re-tap the parquet every 10 to 15 m². At the time of installation, the wood moisture content should be between 7 and 11% (according to EN 13226-13227). The relative humidity should be between 45 and 65% before, during, and after installation. Remove adhesive stains immediately, for example with a damp cloth.